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有色金属(冶炼部分):2022,(12):23-28
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EDTA和EDTA+CA浸出电镀污泥中金属铜的动力学
邓迪, 邓春健, 刘婷婷, 薛丁乾, 邬嘉仪
(南昌航空大学)
Leaching Kinetics of Copper from Electroplating Sludge by EDTA and EDTA+CA
DENG DI, DENG Chun-jian, LIU Ting-ting, XUE Ding-qian, WU Jia-yi
(Nanchang Hangkong University, Nanchang)
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投稿时间:2022-08-09     修订日期:2022-08-13     录用日期:2022-08-30     网络发布日期:2022-11-14
中文摘要: 采用EDTA和EDTA+柠檬酸(CA)两种浸出剂浸出电镀污泥中金属铜,重点研究了EDTA浓度、EDTA+CA中CA的比例、温度对金属铜浸出的影响,并分析了浸出动力学。结果表明,EDTA剂在70 mmol/L、温度55 ℃、浸出时间3 h的条件下对铜的浸出率达到了80.61%,而70 mmol/L EDTA+10 mmol/L CA、温度55 ℃、浸出时间3 h的条件下对铜的浸出率为90.32%。浸出过程可用Avrami方程加以描述,EDTA和EDTA+CA浸出反应表观活化能分别为43.00、45.74 kJ/mol,浸出均属于混合控制且以表面化学控制为主导。
中文关键词: EDTA  柠檬酸  电镀污泥  铜  浸出动力学  Avrami模型
Abstract:The metallic copper in electroplating sludge was leached by two leaching agents, EDTA and EDTA mixed with citric acid (EDTA+CA). The effects of EDTA concentration, ratio of CA in EDTA+CA, and temperature on leaching of copper were studied, and the leaching kinetics was analyzed. The results show that copper leaching rate by EDTA is 80.61% under the conditions including EDTA concentration of 70 mmol/L, temperature of 55 ℃, and leaching time of 3 h, while copper leaching rate by EDTA+CA is 90.32% under the conditions including 70 mmol/L EDTA + 10 mmol/L CA, temperature of 55 ℃, and leaching time of 3 h. The leaching process can be described by Avrami equation, and the apparent activation energies of EDTA and EDTA+CA leaching reactions are 43.00 and 45.74 kJ/mol, respectively. The leaching is all mixed control and dominated by surface chemical control.
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基金项目:江西省“双千万计划”人选资助项目(JXSQ2019201019)
引用文本:
邓迪,邓春健,刘婷婷,薛丁乾,邬嘉仪.EDTA和EDTA+CA浸出电镀污泥中金属铜的动力学[J].有色金属(冶炼部分),2022(12):23-28.
DENG DI,DENG Chun-jian,LIU Ting-ting,XUE Ding-qian,WU Jia-yi.Leaching Kinetics of Copper from Electroplating Sludge by EDTA and EDTA+CA[J].Nonferrous Metals (Extractive Metallurgy),2022(12):23-28.

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