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投稿时间:2022-02-10 修订日期:2022-03-02 录用日期:2022-03-03 网络发布日期:2022-07-13
投稿时间:2022-02-10 修订日期:2022-03-02 录用日期:2022-03-03 网络发布日期:2022-07-13
中文摘要: 目前广泛使用的印刷电路板中,金属Cu的含量一般在20%~30%。废电路板熔炼企业从废电路板中回收Cu和其他金属元素,火法熔炼过程产生废气、废水和固废。选取典型火法废电路板熔炼企业,分析熔炼过程污染物排放特征,测算了主要大气污染物排放系数;对重金属的主要存在形式进行实测,揭示熔池熔炼火法工艺重金属污染物的迁移规律。确定Cu、Pb、Sn为重点控制的重金属污染物,并对不同赋存对象的占比进行比较。
Abstract:Content of Cu in currently widely-used printed circuit board is 20%-30%. Waste circuit board smelting enterprises recycle Cu and other metal elements from waste circuit boards, and the smelting process generates waste gas, waste water and solid waste. The pollutant emission characteristics of a typical waste circuit board smelting enterprises were analyzed and the emission coefficients of main air pollutants were calculated. The main existing forms of heavy metals were measured to reveal the migration law of heavy metal pollutants in the molten pool smelting process. Cu, Pb and Sn were determined as the key heavy metal pollutants, and the proportions of different occurrence objects were compared.
keywords: waste circuit board smelting pollutant emission heavy metals emission characteristics migration law
文章编号: 中图分类号: 文献标志码:
基金项目:国家重点研发计划项目(2018YFC1903105)
| 作者 | 单位 | |
| 王芳* | 矿冶科技集团有限公司 100160 | wangfang920@126.com |
| 黄雪约 | 广西壮族自治区固体废物和化学品环境管理中心 | |
| 刘艳丽 | 矿冶科技集团有限公司 100160 | |
| 童震松 | 矿冶科技集团有限公司 100160 | |
| 赵志龙 | 矿冶科技集团有限公司 100160 |
| Author Name | Affiliation | |
| WANG Fang | BGRIMM | wangfang920@126.com |
| HUANG Xue-yue | ||
| LIU Yan-li | ||
| TONG Zhen-song | ||
| ZHAO Zhi-long |
引用文本:
王芳,黄雪约,刘艳丽,童震松,赵志龙.典型废电路板熔炼工艺污染物排放特征及迁移规律[J].有色金属(冶炼部分),2022(8):98-101.
WANG Fang,HUANG Xue-yue,LIU Yan-li,TONG Zhen-song,ZHAO Zhi-long.Pollutant Emission Characteristics and Migration Law of Typical Waste Circuit Board Smelting Process[J].Nonferrous Metals (Extractive Metallurgy),2022(8):98-101.
王芳,黄雪约,刘艳丽,童震松,赵志龙.典型废电路板熔炼工艺污染物排放特征及迁移规律[J].有色金属(冶炼部分),2022(8):98-101.
WANG Fang,HUANG Xue-yue,LIU Yan-li,TONG Zhen-song,ZHAO Zhi-long.Pollutant Emission Characteristics and Migration Law of Typical Waste Circuit Board Smelting Process[J].Nonferrous Metals (Extractive Metallurgy),2022(8):98-101.

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