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投稿时间：2021-09-07 修订日期：2021-09-08 录用日期：2021-09-10 网络发布日期：2021-10-20
投稿时间：2021-09-07 修订日期：2021-09-08 录用日期：2021-09-10 网络发布日期：2021-10-20
中文摘要: 为厘清铜电沉积过程中枝晶生长规律，探讨了各因素如有无添加剂（盐酸、十二烷基硫酸钠和明胶）、电压、Cu2+浓度等对铜面电极电沉积过程中枝晶生长的影响。结果表明，无添加剂时，增大电压和Cu2+浓度，都有利于增加铜枝晶数量；高电压，尤其是电压为25 V时，铜枝晶现象十分显著。盐酸能促进铜枝晶分形，而十二烷基硫酸钠、明胶可以抑制铜枝晶生长现象。
Abstract:In order to understand dendrite growth (fractal growth) law during copper electrodeposition, effects of additives (HCl, sodium dodecyl sulfate and gelatin), voltage, and Cu2+ concentration on its fractal growth on parallel electrodes were discussed. The results show that voltage and Cu2+ concentration are beneficial to development of cathode copper dendrites, especially high voltage, i.e.25 V, which could significantly impact fractal growth of cathode copper. Compared with no additives, HCl addition can promote fractal and dendrite formation of cathode copper, while the other two additives, sodium dodecyl sulfate and gelatin, can inhibit copper fractal growth.
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基金项目:国家自然科学基金面上项目（51974262）
引用文本：
薛鹏,易小霞,陈姝媛,王继钦,陈梦君,舒建成,王蓉.面电极铜电沉积分形生长规律研究[J].有色金属（冶炼部分）,2021(11):31-36.
XUE Peng,YI Xiao-xia,CHEN Shu-yuan,WANG Ji-qin,CHEN Meng-jun,SHU Jian-cheng,WANG Rong.Fractal Growth of Cu Electrodeposited on Parallel Electrode[J].Nonferrous Metals (Extractive Metallurgy),2021(11):31-36.
薛鹏,易小霞,陈姝媛,王继钦,陈梦君,舒建成,王蓉.面电极铜电沉积分形生长规律研究[J].有色金属（冶炼部分）,2021(11):31-36.
XUE Peng,YI Xiao-xia,CHEN Shu-yuan,WANG Ji-qin,CHEN Meng-jun,SHU Jian-cheng,WANG Rong.Fractal Growth of Cu Electrodeposited on Parallel Electrode[J].Nonferrous Metals (Extractive Metallurgy),2021(11):31-36.
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