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投稿时间:2012-07-30 修订日期:2012-08-02 录用日期:2012-08-02 网络发布日期:2012-12-25
投稿时间:2012-07-30 修订日期:2012-08-02 录用日期:2012-08-02 网络发布日期:2012-12-25
中文摘要: 在35 μm载体铜箔上电镀一层高锌低镍合金镀层作为剥离层,再在焦磷酸盐液中电沉积超薄铜箔层,最后制得载体支撑超薄铜箔。考察了镀液硫酸锌和硫酸镍的配比、焦磷酸钾络合剂及明胶添加剂等对剥离层性能的影响。结果表明,在剥离层镀液中Zn2 ∶Ni2 =4∶1,焦磷酸钾0.5 mol/L,明胶0.2 g/L,十二烷基苯磺酸钠0.2~0.3 g/L条件下,锌和镍能够共同沉积,该镀层作为剥离层后剥离效果良好,载体箔和超薄铜箔间的剥离强度较稳定,可以达到4.7 N/cm。
Abstract:High-zinc and low-nickel alloy coating used for stripping layer on 35 μm ultra-thin copper foil as carrier foil was electrodeposited. Ultra-thin copper foil was electrodeposited in pyrophosphate solution, and then ultra-thin copper carrier foil was prepared. The effects of ratio of zinc sulfate and nickel sulfate, dosage of complexing agent of potassium pyrophosphate trihydrate, dosage of additives of gelatin on the properties of stripping layer were investigated. The results show that zinc and nickel can be co-electroplated under the conditions including zinc sulfate of 12 g/L, nickel sulfate of 6 g/L, potassium pyrophosphate trihydrate of 0.5 mol/L, gelatin of 0.2 g/L and sodium dodecyl benzene sulfonate 0.2~0.3 g/L. Peelable strength between ultra-thin copper foil and carrier copper foil is stable and can reach 4.7 N/cm when zinc-nickel alloy is used as a stripping layer.
keywords: Zn-Ni alloy ultra-thin copper foil stripping layer
文章编号: 中图分类号: 文献标志码:
基金项目:国家青年自然科学基金资助项目(51104072)
| 作者 | 单位 | |
| 邓庚凤* | 江西理工大学冶金与化学工程学院 | gfdeng26@126.com |
| 黄崛起 | 江西理工大学冶金与化学工程学院 | |
| 赖远腾 | 江西理工大学冶金与化学工程学院 | |
| 徐鹏 | 江西理工大学冶金与化学工程学院 |
引用文本:
邓庚凤,黄崛起,赖远腾,徐鹏.锌镍合金用于载体支撑超薄铜箔剥离层的研究[J].有色金属(冶炼部分),2013(1):41-44.
Gengfeng-Deng,Jueqi-Huang,Yuanteng-Lai,Peng-Xu.Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil[J].Nonferrous Metals (Extractive Metallurgy),2013(1):41-44.
邓庚凤,黄崛起,赖远腾,徐鹏.锌镍合金用于载体支撑超薄铜箔剥离层的研究[J].有色金属(冶炼部分),2013(1):41-44.
Gengfeng-Deng,Jueqi-Huang,Yuanteng-Lai,Peng-Xu.Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil[J].Nonferrous Metals (Extractive Metallurgy),2013(1):41-44.

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